Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 μm and 60 μm Diameter

Dohle, Rainer, Stefan Härter, Andreas Wirth, Jörg Goßler, Marek Gorywoda, Andreas Reinhardt, and Jörg Franke. 2012. “Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 Μm and 60 Μm Diameter.” IMAPSource Proceedings 2012 (1): 891–905. https:/​/​doi.org/​10.4071/​isom-2012-WP41.