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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Challenges in Assembly implementation of ultra-thin profile flipchip package-on-package

Abu Eghan, Kyoo B Choi,
Copper-pillar with RDLLow profile flipchipPackage on package0.4mm PoP pitch
https://doi.org/10.4071/isom-2016-THP31
IMAPSource Conference Papers
Eghan, Abu, and Kyoo B Choi. 2016. “Challenges in Assembly Implementation of Ultra-Thin Profile Flipchip Package-on-Package.” IMAPSource Proceedings 2016 (1): 591–97. https:/​/​doi.org/​10.4071/​isom-2016-THP31.
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