Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Challenges in Assembly implementation of ultra-thin profile flipchip package-on-package
Challenges in Assembly implementation of ultra-thin profile flipchip package-on-package
Eghan, Abu, and Kyoo B Choi. 2016. “Challenges in Assembly Implementation of Ultra-Thin Profile Flipchip Package-on-Package.” IMAPSource Proceedings 2016 (1): 591–97. https://doi.org/10.4071/isom-2016-THP31.