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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Challenges in Assembly implementation of ultra-thin profile flipchip package-on-package
Abu Eghan
,
Kyoo B Choi
,
Copper-pillar with RDL
Low profile flipchip
Package on package
0.4mm PoP pitch
•
https://doi.org/10.4071/isom-2016-THP31
IMAPSource Conference Papers
Eghan, Abu, and Kyoo B Choi. 2016. “Challenges in Assembly Implementation of Ultra-Thin Profile Flipchip Package-on-Package.”
IMAPSource Proceedings
2016 (1): 591–97.
https://doi.org/10.4071/isom-2016-THP31
.
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