Challenges in Assembly implementation of ultra-thin profile flipchip package-on-package

Abu Eghan; Kyoo B Choi

doi:10.4071/isom-2016-THP31

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Eghan, Abu, and Kyoo B Choi. 2016. “Challenges in Assembly Implementation of Ultra-Thin Profile Flipchip Package-on-Package.” IMAPSource Proceedings 2016 (1): 591–97. https://doi.org/10.4071/isom-2016-THP31.

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