Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Surface Energy and Wettability Study of Flip Chip Packaging Materials
Surface Energy and Wettability Study of Flip Chip Packaging Materials
Wang, Jinlin. 2011. “Surface Energy and Wettability Study of Flip Chip Packaging Materials.” IMAPSource Proceedings 2011 (1): 961–70. https://doi.org/10.4071/isom-2011-THA3-Paper2.