Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Embedded solutions: Fan-out and Embedded Die Packages market and technology trends
Embedded solutions: Fan-out and Embedded Die Packages market and technology trends
Azémar, Jérôme. 2015. “Embedded Solutions: Fan-out and Embedded Die Packages Market and Technology Trends.” IMAPSource Proceedings 2015 (1): 235–38. https://doi.org/10.4071/isom-2015-WA31.