Structural Electronics through Additive Manufacturing and Micro-Dispensing

Richard Olivas; Rudy Salas; Dan Muse; Eric MacDonald; Ryan Wicker; Mike Newton; Ken Church

doi:10.4071/isom-2010-THA5-Paper6

Loading [Contrib]/a11y/accessibility-menu.js

Olivas, Richard, Rudy Salas, Dan Muse, Eric MacDonald, Ryan Wicker, Mike Newton, and Ken Church. 2010. “Structural Electronics through Additive Manufacturing and Micro-Dispensing.” IMAPSource Proceedings 2010 (1): 940–46. https://doi.org/10.4071/isom-2010-THA5-Paper6.

View more stats