Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities
Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities
Kadoguchi, Takuya, Kimihiro Yamanaka, Shijo Nagao, and Katsuaki Suganuma. 2015. “Solder Electromigration Behavior in Cu/Electroless Ni–P Plating/Sn–Cu Based Joint System at Low Current Densities.” IMAPSource Proceedings 2015 (1): 141–46. https://doi.org/10.4071/isom-2015-TP53.