Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP)

Lau, John, Pei-Jer Tzeng, Chau-Jie Zhan, Ching-Kuan Lee, Ming-Ji Dai, Jui-Chin Chen, Yu-Chen Hsin, et al. 2012. “Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP).” IMAPSource Proceedings 2012 (1): 1209–14. https:/​/​doi.org/​10.4071/​isom-2012-THP61.