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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP)

John Lau, Pei-Jer Tzeng, Chau-Jie Zhan, Ching-Kuan Lee, Ming-Ji Dai, Jui-Chin Chen, Yu-Chen Hsin, Shang-Chun Chen, Chien-Ying Wu, Li Li, Peng Su, Jie Xue, Mark Brillhart,
3D IC integration through silicon via (TSV) interposer microbumps assembly
• https://doi.org/10.4071/isom-2012-THP61
IMAPSource Conference Papers
Lau, John, Pei-Jer Tzeng, Chau-Jie Zhan, Ching-Kuan Lee, Ming-Ji Dai, Jui-Chin Chen, Yu-Chen Hsin, et al. 2012. “Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP).” IMAPSource Proceedings 2012 (1): 1209–14. https://doi.org/10.4071/isom-2012-THP61.
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