Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP)

John Lau; Pei-Jer Tzeng; Chau-Jie Zhan; Ching-Kuan Lee; Ming-Ji Dai; Jui-Chin Chen; Yu-Chen Hsin; Shang-Chun Chen; Chien-Ying Wu; Li Li; Peng Su; Jie Xue; Mark Brillhart

doi:10.4071/isom-2012-THP61

Lau, John, Pei-Jer Tzeng, Chau-Jie Zhan, Ching-Kuan Lee, Ming-Ji Dai, Jui-Chin Chen, Yu-Chen Hsin, et al. 2012. “Large Size Silicon Interposer and 3D IC Integration for System-in-Packaging (SiP).” IMAPSource Proceedings 2012 (1): 1209–14. https://doi.org/10.4071/isom-2012-THP61.

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