Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Managing Voids in Underfill Process with 5-micron Gap Under Large Die
Managing Voids in Underfill Process with 5-micron Gap Under Large Die
Liang, Hanzhuang, and Nordson Asymtek. 2012. “Managing Voids in Underfill Process with 5-Micron Gap Under Large Die.” IMAPSource Proceedings 2012 (1): 376–83. https://doi.org/10.4071/isom-2012-TP36.