Vol. 2013, Issue 1, 2013January 01, 2013 EDT
High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure
High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure
Xu, Min, Robert Geer, Pavel Kabos, and Thomas Wallis. 2013. “High Speed Signal Transmission Using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure.” IMAPSource Proceedings 2013 (1): 228–32. https://doi.org/10.4071/isom-2013-TP13.
Powered by Scholastica, the modern academic journal management system