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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure
Min Xu
,
Robert Geer
,
Pavel Kabos
,
Thomas Wallis
,
3DIC
CPW
EM field confinement
RF
TSV
•
https://doi.org/10.4071/isom-2013-TP13
IMAPSource Conference Papers
Xu, Min, Robert Geer, Pavel Kabos, and Thomas Wallis. 2013. “High Speed Signal Transmission Using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure.”
IMAPSource Proceedings
2013 (1): 228–32.
https://doi.org/10.4071/isom-2013-TP13
.
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