Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization

Celso Cavaco; Lan Peng; Koen De Leersnijder; Stefano Guerrieri; Deniz S. Tezcan; Haris Osman

doi:10.4071/isom-2015-THA26

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Cavaco, Celso, Lan Peng, Koen De Leersnijder, Stefano Guerrieri, Deniz S. Tezcan, and Haris Osman. 2015. “Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization.” IMAPSource Proceedings 2015 (1): 594–97. https://doi.org/10.4071/isom-2015-THA26.

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