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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization

Celso Cavaco, Lan Peng, Koen De Leersnijder, Stefano Guerrieri, Deniz S. Tezcan, Haris Osman,
CMOS devicecopper oxide direct bondingdamascene process200mm wafers
https://doi.org/10.4071/isom-2015-THA26
IMAPSource Conference Papers
Cavaco, Celso, Lan Peng, Koen De Leersnijder, Stefano Guerrieri, Deniz S. Tezcan, and Haris Osman. 2015. “Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization.” IMAPSource Proceedings 2015 (1): 594–97. https:/​/​doi.org/​10.4071/​isom-2015-THA26.
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