Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization
Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization
Cavaco, Celso, Lan Peng, Koen De Leersnijder, Stefano Guerrieri, Deniz S. Tezcan, and Haris Osman. 2015. “Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization.” IMAPSource Proceedings 2015 (1): 594–97. https://doi.org/10.4071/isom-2015-THA26.