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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
NSOP Reduction for QFN RF-IC Packages
Mumtaz Y. Bora
,
NSOP
QFN
wire-bonding
wafer
AOI
•
https://doi.org/10.4071/isom-2016-Poster6
IMAPSource Conference Papers
Bora, Mumtaz Y. 2016. “NSOP Reduction for QFN RF-IC Packages.”
IMAPSource Proceedings
2016 (1): 530–34.
https://doi.org/10.4071/isom-2016-Poster6
.
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