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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Glass Packaging for RF MEMS
Rajiv Parmar
,
Jay Zhang
,
Chris Keimel
,
Glass interposer
through glass via (TGV)
RF MEMS
glass substrates
RFFE
•
https://doi.org/10.4071/2380-4505-2018.1.000680
IMAPSource Conference Papers
Parmar, Rajiv, Jay Zhang, and Chris Keimel. 2018. “Glass Packaging for RF MEMS.”
IMAPSource Proceedings
2018 (1): 680–84.
https://doi.org/10.4071/2380-4505-2018.1.000680
.
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