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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Glass Packaging for RF MEMS

Rajiv Parmar, Jay Zhang, Chris Keimel,
Glass interposerthrough glass via (TGV)RF MEMSglass substratesRFFE
https://doi.org/10.4071/2380-4505-2018.1.000680
IMAPSource Conference Papers
Parmar, Rajiv, Jay Zhang, and Chris Keimel. 2018. “Glass Packaging for RF MEMS.” IMAPSource Proceedings 2018 (1): 680–84. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000680.
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