Solder Strength Characterization Using Hot Bump Pull Testing | Published in IMAPSource Proceedings

IMAPSource Conference Papers

O’Connell, Kevin, and Arv Sinha. 2011. “Solder Strength Characterization Using Hot Bump Pull Testing.” IMAPSource Proceedings 2011 (1): 690–93. https://doi.org/10.4071/isom-2011-WP2-Paper1.

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