Vol. 2016, Issue 1, 2016October 01, 2016 EDT
High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package
High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package
Jin, Howard (Hwail), Kewei Xu, Loreto Naungayan, and Jose Quinones. 2016. “High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package.” IMAPSource Proceedings 2016 (1): 326–31. https://doi.org/10.4071/isom-2016-WP41.