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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

System I/O Optimization with SoC, SiP, PCB Co-Design

Lance Wang,
Co-design silicon interposers 3D-IC packages printed circuit boards (PCBs)
• https://doi.org/10.4071/2380-4505-2019.1.000013
IMAPSource Conference Papers
Wang, Lance. 2019. “System I/O Optimization with SoC, SiP, PCB Co-Design.” IMAPSource Proceedings 2019 (1): 13–18. https://doi.org/10.4071/2380-4505-2019.1.000013.
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