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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
System I/O Optimization with SoC, SiP, PCB Co-Design
Lance Wang
,
Co-design
silicon interposers
3D-IC
packages
printed circuit boards (PCBs)
•
https://doi.org/10.4071/2380-4505-2019.1.000013
IMAPSource Conference Papers
Wang, Lance. 2019. “System I/O Optimization with SoC, SiP, PCB Co-Design.”
IMAPSource Proceedings
2019 (1): 13–18.
https://doi.org/10.4071/2380-4505-2019.1.000013
.
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