Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip
Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip
Kim, Dongjin, Shijo Nagao, Naoki Wakasugi, Yasuyuki Yamamoto, Aiji Suetake, Tetsu Takemasa, and Katsuaki Suganuma. 2018. “Power Cycle Tests of High Temperature Ag Sinter Die-Attach on Metalized Ceramic Substrate by Using Micro-Heater SiC Chip.” IMAPSource Proceedings 2018 (1): 84–87. https://doi.org/10.4071/2380-4505-2018.1.000084.