Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chip

Dongjin Kim; Shijo Nagao; Naoki Wakasugi; Yasuyuki Yamamoto; Aiji Suetake; Tetsu Takemasa; Katsuaki Suganuma

doi:10.4071/2380-4505-2018.1.000084

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Kim, Dongjin, Shijo Nagao, Naoki Wakasugi, Yasuyuki Yamamoto, Aiji Suetake, Tetsu Takemasa, and Katsuaki Suganuma. 2018. “Power Cycle Tests of High Temperature Ag Sinter Die-Attach on Metalized Ceramic Substrate by Using Micro-Heater SiC Chip.” IMAPSource Proceedings 2018 (1): 84–87. https://doi.org/10.4071/2380-4505-2018.1.000084.

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