Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Suppression of Kirkendall voiding in Sn-3.5Ag/Cu solder joints by pre-annealing process
Suppression of Kirkendall voiding in Sn-3.5Ag/Cu solder joints by pre-annealing process
Kim, S. H., and Jin Yu. 2011. “Suppression of Kirkendall Voiding in Sn-3.5Ag/Cu Solder Joints by Pre-Annealing Process.” IMAPSource Proceedings 2011 (1): 337–40. https://doi.org/10.4071/isom-2011-TP4-Paper3.