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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

John H Lau, Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, JJ Chen, Po-Chun Huang, Tzvy-Jang Tseng, Eagle Lin, Leo Chang, Curry Lin, Winnie Lu,
Fan-out packaging RDL-first chip-last panel-level packaging heterogeneous integration drop test
• https://doi.org/10.4071/2380-4505-2020.1.000042
IMAPSource Conference Papers
Lau, John H, Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, JJ Chen, et al. 2020. “Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration.” IMAPSource Proceedings 2020 (1): 42–50. https://doi.org/10.4071/2380-4505-2020.1.000042.
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