Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
Lau, John H, Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, JJ Chen, et al. 2020. “Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration.” IMAPSource Proceedings 2020 (1): 42–50. https://doi.org/10.4071/2380-4505-2020.1.000042.