Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C

Jie Geng; Hongwen Zhang; Francis Mutuku; Ning-Cheng Lee

doi:10.4071/2380-4505-2018.1.000198

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Geng, Jie, Hongwen Zhang, Francis Mutuku, and Ning-Cheng Lee. 2018. “Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C.” IMAPSource Proceedings 2018 (1): 198–206. https://doi.org/10.4071/2380-4505-2018.1.000198.

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