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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C
Jie Geng
,
Hongwen Zhang
,
Francis Mutuku
,
Ning-Cheng Lee
,
reliability
automotive
90.6Sn3.2Ag0.7Cu5.5Sb
276
ductility
SAC
die attach
thermal aging
thermal cycling test
TCT
thermal shock test
TST
•
https://doi.org/10.4071/2380-4505-2018.1.000198
IMAPSource Conference Papers
Geng, Jie, Hongwen Zhang, Francis Mutuku, and Ning-Cheng Lee. 2018. “Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175C.”
IMAPSource Proceedings
2018 (1): 198–206.
https://doi.org/10.4071/2380-4505-2018.1.000198
.
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