Increase Power Density and Simplify Designs Using 3-D SiP Modules

Steven Kummerl; Charles Devries; Usman Chaudhry; Chong Han Lim

doi:10.4071/2380-4505-2018.1.000326

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Kummerl, Steven, Charles Devries, Usman Chaudhry, and Chong Han Lim. 2018. “Increase Power Density and Simplify Designs Using 3-D SiP Modules.” IMAPSource Proceedings 2018 (1): 326–30. https://doi.org/10.4071/2380-4505-2018.1.000326.

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