Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Increase Power Density and Simplify Designs Using 3-D SiP Modules
Increase Power Density and Simplify Designs Using 3-D SiP Modules
Kummerl, Steven, Charles Devries, Usman Chaudhry, and Chong Han Lim. 2018. “Increase Power Density and Simplify Designs Using 3-D SiP Modules.” IMAPSource Proceedings 2018 (1): 326–30. https://doi.org/10.4071/2380-4505-2018.1.000326.