Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach

Otiaba, K. C., N. Raju, R. S. Bhatti, S. Mallik, and P.K. Bernasko. 2012. “Influence of Thermal Ageing on Void Content and Shear Strength for Selected Lead Free Solder Die-Attach.” IMAPSource Proceedings 2012 (1): 882–90. https://doi.org/10.4071/isom-2012-WP36.