Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach

K. C. Otiaba; N. Raju; R. S. Bhatti; S. Mallik; P.K. Bernasko

doi:10.4071/isom-2012-WP36

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Otiaba, K. C., N. Raju, R. S. Bhatti, S. Mallik, and P.K. Bernasko. 2012. “Influence of Thermal Ageing on Void Content and Shear Strength for Selected Lead Free Solder Die-Attach.” IMAPSource Proceedings 2012 (1): 882–90. https://doi.org/10.4071/isom-2012-WP36.

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