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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach

K. C. Otiaba, N. Raju, R. S. Bhatti, S. Mallik, P.K. Bernasko,
Pb-free solder Die-attach Thermal ageing Voids Shear strength Chip scale package
• https://doi.org/10.4071/isom-2012-WP36
IMAPSource Conference Papers
Otiaba, K. C., N. Raju, R. S. Bhatti, S. Mallik, and P.K. Bernasko. 2012. “Influence of Thermal Ageing on Void Content and Shear Strength for Selected Lead Free Solder Die-Attach.” IMAPSource Proceedings 2012 (1): 882–90. https://doi.org/10.4071/isom-2012-WP36.
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