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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Thin Glass Handling Solutions for Microelectronics Packaging

Aric Shorey, Shelby Nelson, David Levy, Paul Ballentine,
Glass through glass via TGV RF substrate
• https://doi.org/10.4071/2380-4505-2020.1.000192
IMAPSource Conference Papers
Shorey, Aric, Shelby Nelson, David Levy, and Paul Ballentine. 2020. “Thin Glass Handling Solutions for Microelectronics Packaging.” IMAPSource Proceedings 2020 (1): 192–96. https://doi.org/10.4071/2380-4505-2020.1.000192.
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