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Symposium Proceedings
Vol. 2020, Issue 1, 2020
September 01, 2020 EDT
Thin Glass Handling Solutions for Microelectronics Packaging
Aric Shorey
,
Shelby Nelson
,
David Levy
,
Paul Ballentine
,
Glass
through glass via
TGV
RF substrate
•
https://doi.org/10.4071/2380-4505-2020.1.000192
IMAPSource Conference Papers
Shorey, Aric, Shelby Nelson, David Levy, and Paul Ballentine. 2020. “Thin Glass Handling Solutions for Microelectronics Packaging.”
IMAPSource Proceedings
2020 (1): 192–96.
https://doi.org/10.4071/2380-4505-2020.1.000192
.
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