Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging
Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging
Yuan, Cadmus, René Kregting, Willem van Driel, Sander Gielen, An Xiao, and G. Q. (Kouchi) Zhang. 2011. “Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging.” IMAPSource Proceedings 2011 (1): 418–29. https://doi.org/10.4071/isom-2011-TP6-Paper4.