Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Study of Warpage and Mechanical Stress of 2.5D Package Interposers during Chip and Interposer Mount Process
Study of Warpage and Mechanical Stress of 2.5D Package Interposers during Chip and Interposer Mount Process
Hisada, Takashi, Yasuharu Yamada, Junko Asai, and Toyohiro Aoki. 2012. “Study of Warpage and Mechanical Stress of 2.5D Package Interposers during Chip and Interposer Mount Process.” IMAPSource Proceedings 2012 (1): 967–74. https://doi.org/10.4071/isom-2012-WP61.