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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
The Future of Solder Joint Encapsulant
Mary Liu
,
Wusheng Yin
,
Solder Joint
Encapsulant
adhesives
thermal cycling
drop performance
underfill
•
https://doi.org/10.4071/isom-2015-THA43
IMAPSource Conference Papers
Liu, Mary, and Wusheng Yin. 2015. “The Future of Solder Joint Encapsulant.”
IMAPSource Proceedings
2015 (1): 644–48.
https://doi.org/10.4071/isom-2015-THA43
.
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