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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

Cheng-Ta Ko, Henry Yang, John Lau, Ming Li, Margie Li, Curry Lin, JW Lin, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, YH Chen, Tony Chen, Iris Xu, Penny Lo, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Chia-Hung Lin, Rozalia Beica, Marc Lin, Cao Xi, Sze Pei Lim, NC Lee, Mian Tao, Jeffery Lo, Ricky Lee,
FOPLPheterogeneous integrationreconstituted panelredistribution layers
https://doi.org/10.4071/2380-4505-2018.1.000057
IMAPSource Conference Papers
Ko, Cheng-Ta, Henry Yang, John Lau, Ming Li, Margie Li, Curry Lin, JW Lin, et al. 2018. “Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration.” IMAPSource Proceedings 2018 (1): 57–63. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000057.
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