Vol. 2014, Issue 1, 2014January 01, 2014 EDT
High Productivity Thermo-Compression Flip Chip Bonding
High Productivity Thermo-Compression Flip Chip Bonding
Colosimo, Tom, Horst Clauberg, Evan Galipeau, Matthew B. Wasserman, Michael Schmidt-Lange, and Bob Chylak. 2014. “High Productivity Thermo-Compression Flip Chip Bonding.” IMAPSource Proceedings 2014 (1): 100–106. https://doi.org/10.4071/isom-TA41.