Vol. 2010, Issue 1, 2010January 01, 2010 EDT
A robust CUP pad structure design with thin pad metal for Cu wire bonding
A robust CUP pad structure design with thin pad metal for Cu wire bonding
Han, ChangHee, SG Kim, JH Shim, DH Jiang, SW Ko, BJ Lee, KC Kim, et al. 2010. “A Robust CUP Pad Structure Design with Thin Pad Metal for Cu Wire Bonding.” IMAPSource Proceedings 2010 (1): 656–60. https://doi.org/10.4071/isom-2010-WP4-Paper2.