A robust CUP pad structure design with thin pad metal for Cu wire bonding

ChangHee Han; SG Kim; JH Shim; DH Jiang; SW Ko; BJ Lee; KC Kim; HG Lee; JS Yoon; BT Jiang; SW Hong; HD Kim; IS Yoo; YS Song; DalSoo Kim; Shihyun Choe

doi:10.4071/isom-2010-WP4-Paper2

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Han, ChangHee, SG Kim, JH Shim, DH Jiang, SW Ko, BJ Lee, KC Kim, et al. 2010. “A Robust CUP Pad Structure Design with Thin Pad Metal for Cu Wire Bonding.” IMAPSource Proceedings 2010 (1): 656–60. https://doi.org/10.4071/isom-2010-WP4-Paper2.

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