Reliability of Multi-Layer Wiring Board Embedded with Two Dies in Stacked Configuration

Munakata, Koji, Nobuki Ueta, Masahiro Okamoto, Kumi Onodera, Kazu Itoi, Satoshi Okude, Osamu Nakao, and Theodore (Ted) G. Tessier. 2014. “Reliability of Multi-Layer Wiring Board Embedded with Two Dies in Stacked Configuration.” IMAPSource Proceedings 2014 (1): 161–64. https:/​/​doi.org/​10.4071/​isom-TA62.