Reliability of Multi-Layer Wiring Board Embedded with Two Dies in Stacked Configuration

Koji Munakata; Nobuki Ueta; Masahiro Okamoto; Kumi Onodera; Kazu Itoi; Satoshi Okude; Osamu Nakao; Theodore (Ted) G. Tessier

doi:10.4071/isom-TA62

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Munakata, Koji, Nobuki Ueta, Masahiro Okamoto, Kumi Onodera, Kazu Itoi, Satoshi Okude, Osamu Nakao, and Theodore (Ted) G. Tessier. 2014. “Reliability of Multi-Layer Wiring Board Embedded with Two Dies in Stacked Configuration.” IMAPSource Proceedings 2014 (1): 161–64. https://doi.org/10.4071/isom-TA62.

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