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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
A NOVEL HIGH THERMAL CONDUCTIVE UNDERFILL FOR FLIP CHIP APPLICATION
Mary Liu
,
Wusheng Yin
,
High thermal conductivity
flip chip
underfill
•
https://doi.org/10.4071/isom-2013-TP31
IMAPSource Conference Papers
Liu, Mary, and Wusheng Yin. 2013. “A NOVEL HIGH THERMAL CONDUCTIVE UNDERFILL FOR FLIP CHIP APPLICATION.”
IMAPSource Proceedings
2013 (1): 265–70.
https://doi.org/10.4071/isom-2013-TP31
.
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