Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants

Jimin Maeng; Dohyuk Ha; William J. Chappell; Pedro P. Irazoqui

doi:10.4071/isom-2012-TA56

Loading [Contrib]/a11y/accessibility-menu.js

Maeng, Jimin, Dohyuk Ha, William J. Chappell, and Pedro P. Irazoqui. 2012. “Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants.” IMAPSource Proceedings 2012 (1): 176–85. https://doi.org/10.4071/isom-2012-TA56.

View more stats