Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants
Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants
Maeng, Jimin, Dohyuk Ha, William J. Chappell, and Pedro P. Irazoqui. 2012. “Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants.” IMAPSource Proceedings 2012 (1): 176–85. https://doi.org/10.4071/isom-2012-TA56.