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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants
Jimin Maeng
,
Dohyuk Ha
,
William J. Chappell
,
Pedro P. Irazoqui
,
Biomedical implants
implantable devices
parylene packaging
wireless powering
3-D packaging
•
https://doi.org/10.4071/isom-2012-TA56
IMAPSource Conference Papers
Maeng, Jimin, Dohyuk Ha, William J. Chappell, and Pedro P. Irazoqui. 2012. “Parylene as Thin Flexible 3-D Packaging Enabler for Biomedical Implants.”
IMAPSource Proceedings
2012 (1): 176–85.
https://doi.org/10.4071/isom-2012-TA56
.
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