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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications

Laura Mirkarimi, Rajesh Katkar, Ron Zhang, Rey Co, Zhijun Zhao,
Package on Package (PoP)wide I/OHigh Bandwidthwarpage controlprojection Moire
https://doi.org/10.4071/isom-2013-TA36
IMAPSource Conference Papers
Mirkarimi, Laura, Rajesh Katkar, Ron Zhang, Rey Co, and Zhijun Zhao. 2013. “A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications.” IMAPSource Proceedings 2013 (1): 94–99. https:/​/​doi.org/​10.4071/​isom-2013-TA36.
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