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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications
Laura Mirkarimi
,
Rajesh Katkar
,
Ron Zhang
,
Rey Co
,
Zhijun Zhao
,
Package on Package (PoP)
wide I/O
High Bandwidth
warpage control
projection Moire
•
https://doi.org/10.4071/isom-2013-TA36
IMAPSource Conference Papers
Mirkarimi, Laura, Rajesh Katkar, Ron Zhang, Rey Co, and Zhijun Zhao. 2013. “A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications.”
IMAPSource Proceedings
2013 (1): 94–99.
https://doi.org/10.4071/isom-2013-TA36
.
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