Vol. 2013, Issue 1, 2013January 01, 2013 EDT
A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications
A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications
Mirkarimi, Laura, Rajesh Katkar, Ron Zhang, Rey Co, and Zhijun Zhao. 2013. “A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications.” IMAPSource Proceedings 2013 (1): 94–99. https://doi.org/10.4071/isom-2013-TA36.
Powered by Scholastica, the modern academic journal management system