Packaging Technology of Multi Deflection Arrays for Multi-Shaped Beam Lithography

T. Burkhardt; M. Mohaupt; M. Hornaff; B. Zaage; E. Beckert; H.-J. Döring; M. Slodowski; K. Reimer; M. Witt; R. Eberhardt; A. Tünnermann

doi:10.4071/isom-2011-WA5-Paper1

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Burkhardt, T., M. Mohaupt, M. Hornaff, B. Zaage, E. Beckert, H.-J. Döring, M. Slodowski, et al. 2011. “Packaging Technology of Multi Deflection Arrays for Multi-Shaped Beam Lithography.” IMAPSource Proceedings 2011 (1): 600–607. https://doi.org/10.4071/isom-2011-WA5-Paper1.

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