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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume Manufacturing

Jin You Zao, Bong Yin Yen, Lim Beng Kuan, John Thornell, Darcy Hart, David Marx,
Wafer Bumping Critical Dimension (CD) Metrology Redistribution Layer (RDL) Under Bump Metal (UBM) WLCSP 3D Triangular Laser Reflectometry Visible Light Interferometry
• https://doi.org/10.4071/isom-TA61
IMAPSource Conference Papers
Zao, Jin You, Bong Yin Yen, Lim Beng Kuan, John Thornell, Darcy Hart, and David Marx. 2014. “Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume Manufacturing.” IMAPSource Proceedings 2014 (1): 155–60. https://doi.org/10.4071/isom-TA61.
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