Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Isothermal DSC study of the curing kinetics of an epoxy/silica composite for microelectronics
Isothermal DSC study of the curing kinetics of an epoxy/silica composite for microelectronics
Granado, Lérys, Stefan Kempa, Stefanie Bremmert, Laurence J. Gregoriades, Frank Brüning, Eric Anglaret, and Nicole Fréty. 2016. “Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for Microelectronics.” IMAPSource Proceedings 2016 (1): 415–20. https://doi.org/10.4071/isom-2016-THA24.