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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration

Douglas Hackler, Edward Prack,
Chip-scale-package Fan-In Fan-Out Antenna-In-Package Semiconductor-on-Polymer Direct Chip Attach
• https://doi.org/10.4071/2380-4505-2020.1.000146
IMAPSource Conference Papers
Hackler, Douglas, and Edward Prack. 2020. “Ultra-Thin Flip-Chip Assembly for Heterogenous and Hybrid Integration.” IMAPSource Proceedings 2020 (1): 146–49. https://doi.org/10.4071/2380-4505-2020.1.000146.
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