Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Hackler, Douglas, and Edward Prack. 2020. “Ultra-Thin Flip-Chip Assembly for Heterogenous and Hybrid Integration.” IMAPSource Proceedings 2020 (1): 146–49. https://doi.org/10.4071/2380-4505-2020.1.000146.
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