ISSN 2380-4505
Vol. 2012, Issue 1, 2012January 01, 2012 EDT
3D Integration of Wide IO Memory Cube Stacking to 28 nm Logic Chip with High Density TSV through a Fabless Supplier Chain
3D Integration of Wide IO Memory Cube Stacking to 28 nm Logic Chip with High Density TSV through a Fabless Supplier Chain
Gu, S.Q., D.W. King, V. Ramachandran, B. Henderson, U. Ray, and M. Nowak. 2012. “3D Integration of Wide IO Memory Cube Stacking to 28 Nm Logic Chip with High Density TSV through a Fabless Supplier Chain.” IMAPSource Proceedings 2012 (1): 18–22. https://doi.org/10.4071/isom-2012-TA14.