Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Development of Backside Buried Metal Layer Technology for 3D-ICs
Development of Backside Buried Metal Layer Technology for 3D-ICs
Watanabe, Naoya, Yuuki Araga, Haruo Shimamoto, Katsuya Kikuchi, and Makoto Nagata. 2019. “Development of Backside Buried Metal Layer Technology for 3D-ICs.” IMAPSource Proceedings 2019 (1): 268–73. https://doi.org/10.4071/2380-4505-2019.1.000268.