Development of Backside Buried Metal Layer Technology for 3D-ICs

Naoya Watanabe; Yuuki Araga; Haruo Shimamoto; Katsuya Kikuchi; Makoto Nagata

doi:10.4071/2380-4505-2019.1.000268

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Watanabe, Naoya, Yuuki Araga, Haruo Shimamoto, Katsuya Kikuchi, and Makoto Nagata. 2019. “Development of Backside Buried Metal Layer Technology for 3D-ICs.” IMAPSource Proceedings 2019 (1): 268–73. https://doi.org/10.4071/2380-4505-2019.1.000268.

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