Vol. 2019, Issue 1, 2019October 01, 2019 EDT
A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization
A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization
Bhogaraju, Sri Krishna, Omid Mokhtari, Jacopo Pascucci, Fosca Conti, Hiren R Kotadia, and Gordon Elger. 2019. “A Multi-Pronged Approach to Low-Pressure Cu Sintering Using Surface-Modified Particles, Substrate and Chip Metallization.” IMAPSource Proceedings 2019 (1): 387–92. https://doi.org/10.4071/2380-4505-2019.1.000387.