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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Ultra-High Density System-in-Package (SiP) for the Lowest Size Weight and Power (SWAP)
Bruce Barbara
,
FO-WLP FAN OUT
CHIPS FIRST
WAFER LEVEL PACKAGE
iUHD
MCM
SIP
SWAP
TSV
HETEROGENEOUS IC INTEGRATION
2.5D
3D
•
https://doi.org/10.4071/isom-2016-WP32
IMAPSource Conference Papers
Barbara, Bruce. 2016. “Ultra-High Density System-in-Package (SiP) for the Lowest Size Weight and Power (SWAP).”
IMAPSource Proceedings
2016 (1): 309–13.
https://doi.org/10.4071/isom-2016-WP32
.
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