Vol. 2016, Issue S2, 2016October 01, 2016 EDT
On the Way from Fan-out Wafer to Fan-out Panel Level Packaging
On the Way from Fan-out Wafer to Fan-out Panel Level Packaging
Becker, Karl-Friedrich, Tanja Braun, S. Raatz, M. Minkus, V. Bader, J. Bauer, R. Aschenbrenner, et al. 2016. “On the Way from Fan-out Wafer to Fan-out Panel Level Packaging.” IMAPSource Proceedings 2016 (S2): S1–23. https://doi.org/10.4071/isom-2016-slide-4.