Vol. 2013, Issue 1, 2013January 01, 2013 EDT
High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining Process
High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining Process
Kawase, Y., M. Ikemoto, M. Yamazaki, M. Sugiyama, H. Kiritani, F. Mizutani, K. Matsumoto, A. Horibe, H. Mori, and Y. Orii. 2013. “High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-Applied Joining Process.” IMAPSource Proceedings 2013 (1): 408–13. https://doi.org/10.4071/isom-2013-TP64.