Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss

Qianfei Su, A. Ege Engin, Jerry Aguirre,
Materials Characterization Dielectric Constant Loss Tangent Cavity Resonator Surface Roughness Cross Section
• https://doi.org/10.4071/isom-2016-WP52
IMAPSource Conference Papers
Su, Qianfei, A. Ege Engin, and Jerry Aguirre. 2016. “Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss.” IMAPSource Proceedings 2016 (1): 358–63. https://doi.org/10.4071/isom-2016-WP52.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system