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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief

Ephraim Suhir, Sung Yi, Jennie S. Hwang, R. Ghaffarian,
Predictive modelingsolder joint interconnectionsstand-off heightsstress reliefwarpage relief
https://doi.org/10.4071/2380-4505-2018.1.000534
IMAPSource Conference Papers
Suhir, Ephraim, Sung Yi, Jennie S. Hwang, and R. Ghaffarian. 2018. “Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief.” IMAPSource Proceedings 2018 (1): 534–42. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000534.
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