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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Superior Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere

Weiping Liu, Ning-Cheng Lee, Simin Bagheri, Polina Snugovesky, Jason Bragg, Russell Brush, Blake Harper,
Drop Testlead-free soldersolder sphereSACTiSAC105TiSACTifracture
https://doi.org/10.4071/isom-2012-WP25
IMAPSource Conference Papers
Liu, Weiping, Ning-Cheng Lee, Simin Bagheri, Polina Snugovesky, Jason Bragg, Russell Brush, and Blake Harper. 2012. “Superior Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere.” IMAPSource Proceedings 2012 (1): 829–43. https:/​/​doi.org/​10.4071/​isom-2012-WP25.
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