Growth of Intermetallics at Coated Silver Wire Bond Interfaces

Sarangapani Murali; Wong Chin Yeung Jason

doi:10.4071/2380-4505-2018.1.000578

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Murali, Sarangapani, and Wong Chin Yeung Jason. 2018. “Growth of Intermetallics at Coated Silver Wire Bond Interfaces.” IMAPSource Proceedings 2018 (1): 578–82. https://doi.org/10.4071/2380-4505-2018.1.000578.

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