Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancement
Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancement
Özkök, Mustafa, Hubertus Mertens, and Jerome Bender. 2013. “Immersion Tin for QFN Packages to Create a 3-D Solder Joint for Reliability Enhancement.” IMAPSource Proceedings 2013 (1): 663–66. https://doi.org/10.4071/isom-2013-WP25.