Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.
Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.
Schafet, Natalja, Bruno Schrempp, Manfred Spraul, Ulrich Becker, and Herbert Güttler. 2011. “Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level.” IMAPSource Proceedings 2011 (1): 409–17. https://doi.org/10.4071/isom-2011-TP6-Paper3.