Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

A Small Feature-Sized Organic interposer for 2.1D Packaging Solutions

Christian Romero, Jeongho Lee, Kyungseob Oh, Kyoungmoo Harr, Youngdo Kweon,
Small Feature-Size Organic interposer 2.1D high I/O count interconnects memory-logic
• https://doi.org/10.4071/isom-WP15
IMAPSource Conference Papers
Romero, Christian, Jeongho Lee, Kyungseob Oh, Kyoungmoo Harr, and Youngdo Kweon. 2014. “A Small Feature-Sized Organic Interposer for 2.1D Packaging Solutions.” IMAPSource Proceedings 2014 (1): 619–23. https://doi.org/10.4071/isom-WP15.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system