Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applications

Keith Best; Ognian Dimov; Sudmun Habib; Sanjay Malik

doi:10.4071/2380-4505-2018.1.000361

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Best, Keith, Ognian Dimov, Sudmun Habib, and Sanjay Malik. 2018. “Lithographic Evaluation of Thin Photoimageable Dielectric Dry Film for Advanced Panel Level Packaging Applications.” IMAPSource Proceedings 2018 (1): 361–64. https://doi.org/10.4071/2380-4505-2018.1.000361.

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